Lead carrier with print-formed terminal pads

摘要

A lead carrier provides support for an integrated circuit chip and associated leads during manufacture as packages containing such chips. The lead carrier includes a temporary support member with multiple package sites. Each package site includes a plurality of terminal pads surrounding a die attach region. The pads are formed of sintered electrically conductive material. A chip is placed at the die attach region and wire bonds extend from the chip to the terminal pads. The pads, chip and wire bonds are all encapsulated within a mold compound. The temporary support member can be peeled away and then the individual package sites can be isolated from each other to provide completed packages including multiple surface mount joints for mounting within an electronic system board. Edges of the pads are contoured to cause the pads to engage with the mold compound to securely hold the pads within the package.

主权项

1. A lead carrier and semiconductor combination, comprising in combination:
a plurality of terminal pads formed of electrically conductive material; said terminal pads each having an upper side opposite a lower side, with edges between said upper side and said lower side; said terminal pads each being a sintered structure of electrically conductive material; a semiconductor having a base opposite an upper surface; a wire bond between at least one of said terminal pads and said semiconductor; said terminal pads, said semiconductor and said wire bonds at least partially encapsulated within a substantially electrically non-conductive material; and wherein said lower side of each said terminal pad and said base of said integrated circuit are each located within a substantially common plane.