Curable resin composition for reflection of light, and optical semiconductor device

摘要

Provided are curable resin compositions capable of giving cured articles that have high light reflectivity, are satisfactorily resistant to heat and light, are tough, and less suffer from light reflectivity reduction with time. A curable resin composition for light reflection includes an alicyclic epoxy compound (A), rubber particles (B), a white pigment (C), a curing agent (D), and a curing accelerator (E). Another curable resin composition for light reflection includes an alicyclic epoxy compound (A), rubber particles (B), a white pigment (C), and a curing catalyst (F).

主权项

1. A curable resin composition for light reflection, comprising: an alicyclic epoxy compound (A); rubber particles (B); a white pigment (C); a curing agent (D); and a curing accelerator (E),
wherein the white pigment (C) is included in an amount from 80 to 500 parts by weight per 100 parts by weight of the total amount of epoxy-containing compounds contained in the curable resin composition for light reflection; and wherein the alicyclic epoxy compound (A) is an alicyclic epoxy compound represented by the following Formula (1): wherein Y represents a single bond or a linkage group, the linkage group being selected from the group consisting of divalent hydrocarbon groups, a carbonyl group, an ether bond, an ester bond, an amide bond, a carbonate bond, and groups each including two or more of them as linked.