formulação de resina, formulação de resina curada e processo de moldagem por infusão de resina a vácuo

摘要

A resin formulation for use in a vacuum resin infusion molding process, said formulation comprising (a) a divinylarene dioxide, and (b) a polyaminoether; wherein the polyaminoether does not have pendent hydroxyl groups; and wherein the resin formulation may have a low viscosity of less than about 400 mPa-s.