| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a highly reliable circuit board available over a long period of time in which a ceramic sintered body and a metal wiring layer can be bonded rigidly, and are not peeled off by the thermal cycle due to the heat generated by operation of an electronic component or repetition of operation, and to provide an electronic device obtained by mounting an electronic component on the circuit board. <P>SOLUTION: In a circuit board 10 including a metal wiring layer 12 on at least one principal surface of a ceramic sintered body 11, the average diameter of holes is 2-10μm in an arbitrary cross section of the metal wiring layer 12, the average area occupation rate of holes is 1-4 area%, and the average inter-centroid distance of holes is 7-15μm. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
