| 摘要 |
<p>An electrolytic copper plating solution for filling for forming microwiring for ULSI, is characterized in that it has a pH of from 1.8 to 3.0. The electrolytic copper plating solution preferably contains a saturated carboxylic acid having from 1 to 4 carbon atoms at a concentration from 0.01 to 2.0 mol/L.</p> |
