发明名称 |
Multilayer electronic structure with through thickness coaxial structures |
摘要 |
A multilayer electronic structure comprising a plurality of dielectric layers extending in an X-Y plane and comprising at least one coaxial pair of stacked posts extending through at least one dielectric layer in a Z direction that is substantially perpendicular to the X-Y plane, wherein the coaxial pair of stacked via posts comprises a central post surrounded by a torroidal via post separated from the central post by a separating tube of dielectric material. |
申请公布号 |
US9185793(B2) |
申请公布日期 |
2015.11.10 |
申请号 |
US201213483185 |
申请日期 |
2012.05.30 |
申请人 |
Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. |
发明人 |
Hurwitz Dror;Chan Simon;Huang Alex |
分类号 |
H05K1/11;H05K1/02;H01L23/498;H05K3/46 |
主分类号 |
H05K1/11 |
代理机构 |
Wiggin and Dana LLP |
代理人 |
Wiggin and Dana LLP ;Rosenblatt Gregory S.;Hall Jonathan D. |
主权项 |
1. A multilayer electronic support structure comprising a plurality of dielectric layers of a dielectric material extending in an X-Y plane and comprising at least one coaxial pair of stacked posts extending through at least one layer of the dielectric material in a Z direction that is perpendicular to the X-Y plane, wherein each of said coaxial pair of stacked via posts comprises a cylindrical central post surrounded by a tubular via post separated from the central post by a separating tube of the dielectric material
wherein the cylindrical central post and the tubular via post are cofabricated; wherein said cylindrical central post is coupled to a voltage source and said tubular via post is coupled to a ground; and wherein, in the Z direction, both said cylindrical central post and said tubular via post have a plurality of seed layers separated by electroplated layers. |
地址 |
Zhuhai CN |