发明名称 |
Manufacturing method of capacitor structure and semiconductor device using the same |
摘要 |
The instant disclosure relates to a semiconductor device which includes a semiconductor substrate, at least one patterned reinforcing layer, a plurality of lower electrodes, and a supporting layer. The at least one patterned reinforcing layer is arranged above the semiconductor substrate, wherein the at least one patterned reinforcing layer has a plurality of reinforcing structures configured to define a plurality of alignment apertures. The lower electrodes are arranged on the semiconductor substrate, wherein N of the lower electrodes pass through each of the alignment apertures, where N is an integer greater than or equal to 1. The supporting layer is arranged above the at least one patterned reinforcing layer and between the lower electrodes. |
申请公布号 |
US9184166(B2) |
申请公布日期 |
2015.11.10 |
申请号 |
US201414272804 |
申请日期 |
2014.05.08 |
申请人 |
Inotera Memories, Inc. |
发明人 |
Lee Tzung-Han;Hu Yaw-Wen;Agarwal Vishnu Kumar |
分类号 |
H01L23/48;H01L27/108;H01L21/8242;H01L21/331 |
主分类号 |
H01L23/48 |
代理机构 |
Rosenberg, Klein & Lee |
代理人 |
Rosenberg, Klein & Lee |
主权项 |
1. A semiconductor device, comprising:
a semiconductor substrate; at least one patterned reinforcing layer arranged above the semiconductor substrate, wherein the at least one patterned reinforcing layer has a plurality of reinforcing structures configured to define a plurality of alignment apertures; a plurality of lower electrodes arranged on the semiconductor substrate, wherein N of the lower electrodes pass through each of the alignment apertures, where N is an integer greater than or equal to 2; and a supporting layer arranged above the at least one patterned reinforcing layer and between the lower electrodes. |
地址 |
Taoyuan County TW |