| 发明名称 |
Apparatus, hybrid laminated body, method and materials for temporary substrate support |
| 摘要 |
A hybrid laminated body is provided that includes a light-transmitting support, a latent release layer disposed upon the light-transmitting support, a joining layer disposed upon the latent release layer, and a polyamide thermoplastic priming layer disposed upon the joining layer. The hybrid laminated body can further include a substrate to be processed such as, for example, a silicon wafer to be ground. Also provided is a method for manufacturing the provided laminated body. |
| 申请公布号 |
US9184083(B2) |
申请公布日期 |
2015.11.10 |
| 申请号 |
US201313953348 |
申请日期 |
2013.07.29 |
| 申请人 |
3M INNOVATIVE PROPERTIES COMPANY |
发明人 |
Mahoney Wayne S.;Kalgutkar Rajdeep S. |
| 分类号 |
H01L21/00;H01L21/683;H01L21/304 |
主分类号 |
H01L21/00 |
| 代理机构 |
|
代理人 |
Bramwell Adam;Gallagher Ann |
| 主权项 |
1. A laminated body comprising:
a light-transmitting support; a latent release layer disposed upon the light-transmitting support; a joining layer disposed upon the latent release layer; and a polyamide thermoplastic priming layer disposed upon the joining layer. |
| 地址 |
St. Paul MN US |
