Memory system that utilizes a wide input/output (I/O) interface to interface memory storage with an interposer

摘要

A memory system is provided in which at least one memory chip and a memory controller chip are mounted in a side-by-side relationship on an interposer. The memory chip is connected to the interposer via a Wide I/O interface to enable the memory chip and the memory controller chip to communicate with each other via the Wide I/O interface. The memory controller chip has an interface for communicating with an interface of an integrated circuit (IC) chip of the memory system.

主权项

1. A memory system comprising:
an interposer comprising a silicon substrate having electrical conductors extending laterally through the interposer and vias that extend vertically through the interposer; at least a first memory chip mounted on an upper surface of the interposer and electrically interconnected with the interposer; a memory controller chip mounted on the upper surface of the interposer and electrically interconnected with the interposer, wherein the memory controller chip and the at least a first memory chip are electrically interconnected with each other via the interposer, and wherein the electrical interconnection between the at least a first memory chip and the interposer and the electrical interconnection between the memory controller chip and the interposer provide a first Wide input/output (I/O) interface between the at least a first memory chip and the memory controller chip; and a circuit board comprising a substrate having at least an upper surface and a lower surface, wherein the electrical interconnection between the circuit board and the interposer comprises a plurality of electrically-conductive bumps disposed in between the upper surface of the circuit board and a lower surface of the interposer, a plurality of electrically-conductive contact pads disposed on a lower surface of the interposer, and a plurality of electrically-conductive pads disposed on the upper surface of the circuit board, wherein the electrically-conductive bumps provide an electrical interconnection between the electrically conductive pads disposed on the lower surface of the interposer and the electrically-conductive contact pads disposed on the upper surface of the circuit board.