发明名称 Magnetic layer patterning by ion implantation
摘要 Provided herein is a method including conformally depositing a first layer over a patterned resist; depositing a second, thicker layer over the first layer; etching the second layer to expose the first layer; and patterning a magnetic layer by ion implantation in accordance with the patterned resist to form a patterned magnet layer.
申请公布号 US9181618(B2) 申请公布日期 2015.11.10
申请号 US201514635847 申请日期 2015.03.02
申请人 Seagate Technology LLC 发明人 Feldbaum Michael;Wago Koichi;Kuo David
分类号 C23C14/48;G11B5/84;G11B5/855;C23C14/06;C23C14/08 主分类号 C23C14/48
代理机构 代理人
主权项 1. A method, comprising: conformally depositing a first layer over a patterned resist; depositing a second, thicker layer over the first layer; etching the second layer to expose the first layer; and patterning a magnetic layer by ion implantation in accordance with the patterned resist.
地址 Cupertino CA US