Control of microstructure in soldered, brazed, welded, plated, cast or vapor deposited manufactured components

摘要

Disclosed are methods and systems for controlling of the microstructures of a soldered, brazed, welded, plated, cast, or vapor deposited manufactured component. The systems typically use relatively weak magnetic fields of either constant or varying flux to affect material properties within a manufactured component, typically without modifying the alloy, or changing the chemical composition of materials or altering the time, temperature, or transformation parameters of a manufacturing process. Such systems and processes may be used with components consisting of only materials that are conventionally characterized as be uninfluenced by magnetic forces.

主权项

1. A method of controlling metal whiskers in lead-free solders, the method comprising:
exposing a low magnetic response fused metal including tin based molten lead-free solder to a magnetic field; solidifying the molten lead-free solder in the presence of the magnetic field, the molten lead-free solder forming a grain structure during solidification; and controlling an orientation of the grain structure of the lead-free solder during solidification based at least in part on an orientation of the magnetic field.