| 发明名称 | Testing device and testing method thereof | ||
| 摘要 | Disclosed are a testing device and a testing method thereof. The testing device includes a frame, a flexible multi-layer substrate and at least one electrical testing point. The frame is positioned corresponding to a chip. At least one electrical connecting point is formed on a surface of the chip. The flexible multi-layer substrate is fixed in the frame. The electrical testing point is corresponding to the electrical connecting point and formed on an upper surface of the flexible multi-layer substrate for contacting the electrical connecting point and performing an electrical test to the chip. Furthermore, the electrical connecting point or the electrical testing point is a bump. | ||
| 申请公布号 | US9182443(B2) | 申请公布日期 | 2015.11.10 |
| 申请号 | US201314079349 | 申请日期 | 2013.11.13 |
| 申请人 | PRINCO MIDDLE EAST FZE | 发明人 | Shaue Gan-how;Yang Chih-kuang |
| 分类号 | G01R31/00;G01R31/26;G01R1/073 | 主分类号 | G01R31/00 |
| 代理机构 | Hauptman Ham, LLP | 代理人 | Hauptman Ham, LLP |
| 主权项 | 1. A testing device, comprising: a frame, positioned corresponding to a chip, and at least one electrical connecting point formed on a surface of the chip; a flexible multi-layer substrate fixed in the frame, wherein the flexible multi-layer substrate is fixed in the frame by soldering edges of the flexible multi-layer substrate; and at least one electrical testing point corresponding to the at least one electrical connecting point, formed on an upper surface of the flexible multi-layer substrate for contacting the at least one electrical connecting point for performing an electrical test to the chip. | ||
| 地址 | Dubai AE | ||