发明名称 ハンダボール印刷機
摘要 <p>The invention discloses a solder ball printer. The invention is object to resolve the technical problem that in the solder ball printing, by simple constitution, it is necessary to uniformly disperse the solder ball one the mask and stuff facing to the mask opening, and simultaneously the residual solder ball can be recovered. In the invention, a solder ball storage part, a solder ball supply part and a solder ball stuffing component are provided on the solder ball supply head, wherein the solder ball storage part stores solder balls; the solder ball supply part is used to supply specified amount of solder balls in the lower direction mask surface of the solder ball storage part; the solder ball stuffing component clips the solder ball supply part, is formed by a plurality of semi- spiral wires on the sided contacted to the mask surface, so that the solder balls are inserted in the opening part of the mask surface in the moving direction of the solder ball supply head, and simultaneously the residual solder balls are scraped off.</p>
申请公布号 JP5808229(B2) 申请公布日期 2015.11.10
申请号 JP20110248737 申请日期 2011.11.14
申请人 发明人
分类号 H01L21/60 主分类号 H01L21/60
代理机构 代理人
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