| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring substrate which permits a yield to be improved by restraining a residual resist and a method of manufacturing a liquid ejection head. <P>SOLUTION: The method of manufacturing a channel forming substrate includes forming a multilayer wiring structure by repeating a plurality of times a photolithography process and a dry etching process using a holder 120 and forming a pattern with a resist 160 as a mask. In the dry etching process, the method includes executing at least once a resist removal process to remove the resist 160 in an area including an area which falls into the overlapping condition before starting the dry etching process after the photolithography process while repeating a plurality of times a pattern forming process in which some of the holder 120 and the resist 160 form a pattern in an overlapping condition in the direction along the surface of a wafer 101, the photolithography process, and the dry etching process. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
