发明名称 Photoelectric conversion device
摘要 A photoelectric conversion device includes a front electrode, a photoelectric conversion layer formed of a semiconductor material, a transparent conductive layer formed of a transparent conductive oxide, a back electrode formed of a metal material, and a conductive layer formed of a semiconductor material primarily of silicon and having a refractive index higher than the transparent conductive layer contactually sandwiched between the transparent conductive layer and the back electrode. The photoelectric conversion device exhibits a high photoelectric conversion efficiency by keeping low the electrical resistance between the semiconductor layer and the back electrode and by increasing reflectance for light having passed though the semiconductor layer.
申请公布号 US9184320(B2) 申请公布日期 2015.11.10
申请号 US201113806024 申请日期 2011.04.27
申请人 Mitsubishi Electric Corporation 发明人 Konishi Hirofumi;Tokioka Hidetada
分类号 H01L31/0224;H01L31/05;H01L31/046;H01L31/056 主分类号 H01L31/0224
代理机构 Oblon, McClelland, Maier & Neustadt, L.L.P. 代理人 Oblon, McClelland, Maier & Neustadt, L.L.P.
主权项 1. A photoelectric conversion device comprising: a front electrode, a photoelectric conversion layer formed of a semiconductor material, a transparent conductive layer formed of a transparent conductive oxide, a conductive layer formed of a semiconductor material consisting primarily of silicon and having a refractive index higher than the transparent conductive layer, a back electrode formed of a metal material; said front electrode, said photoelectric conversion layer, said transparent conductive layer, said conductive layer, and said back electrode arranged in that order; the conductive layer contactually sandwiched between the transparent conductive layer and the back electrode; the back electrode directly contacting the conductive layer along a plane parallel to the major longitudinal axis of the conductive layer; the refractive index of the conductive layer being 3.4 or higher at a wavelength of 850 nm; and a film thickness of the conductive layer being between 30 nm and 300 nm.
地址 Tokyo JP