发明名称 |
Photoelectric conversion device |
摘要 |
A photoelectric conversion device includes a front electrode, a photoelectric conversion layer formed of a semiconductor material, a transparent conductive layer formed of a transparent conductive oxide, a back electrode formed of a metal material, and a conductive layer formed of a semiconductor material primarily of silicon and having a refractive index higher than the transparent conductive layer contactually sandwiched between the transparent conductive layer and the back electrode. The photoelectric conversion device exhibits a high photoelectric conversion efficiency by keeping low the electrical resistance between the semiconductor layer and the back electrode and by increasing reflectance for light having passed though the semiconductor layer. |
申请公布号 |
US9184320(B2) |
申请公布日期 |
2015.11.10 |
申请号 |
US201113806024 |
申请日期 |
2011.04.27 |
申请人 |
Mitsubishi Electric Corporation |
发明人 |
Konishi Hirofumi;Tokioka Hidetada |
分类号 |
H01L31/0224;H01L31/05;H01L31/046;H01L31/056 |
主分类号 |
H01L31/0224 |
代理机构 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
代理人 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
主权项 |
1. A photoelectric conversion device comprising:
a front electrode, a photoelectric conversion layer formed of a semiconductor material, a transparent conductive layer formed of a transparent conductive oxide, a conductive layer formed of a semiconductor material consisting primarily of silicon and having a refractive index higher than the transparent conductive layer, a back electrode formed of a metal material; said front electrode, said photoelectric conversion layer, said transparent conductive layer, said conductive layer, and said back electrode arranged in that order; the conductive layer contactually sandwiched between the transparent conductive layer and the back electrode; the back electrode directly contacting the conductive layer along a plane parallel to the major longitudinal axis of the conductive layer; the refractive index of the conductive layer being 3.4 or higher at a wavelength of 850 nm; and a film thickness of the conductive layer being between 30 nm and 300 nm. |
地址 |
Tokyo JP |