CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a circuit board excellent in bond strength between an insulation substrate and a metal plate bonded to the insulation substrate and including a wiring circuit formed thereon and also excellent in bonding reliability by reducing the occurrence of peeling, warpage or the like due to thermal cycles from low temperatures to high temperatures.SOLUTION: A circuit board includes an insulation substrate, a metal plate bonded to one surface or both surfaces of the insulation substrate, and a bonding layer bonding the insulation substrate with the metal plate. The bonding layer comprises: a metal coating formed on one surface or both surfaces of the insulation substrate and made of active metal capable of forming an eutectic with Ni; and a Ni sintered layer formed by sintering Ni particles. Further, Ni particles in the Ni sintered layer are Ni fine particles having an average particle size of 15-150 nm as measured through SEM observation, and the thickness of the Ni sintered layer is 10-200 μm.