发明名称 MULTILAYER ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a multilayer electronic component in which shrinkage is matched, and delamination, diffusion and cracking due to heterojunction of a dielectric and a magnetic material, and peeling of the magnetic material and an insert can be prevented, and to provide a method of manufacturing the same.SOLUTION: A multilayer electronic component includes a ceramic body 110 formed by laminating a plurality of magnetic material layers, non-magnetic material layers 112 arranged between the magnetic material layers, an internal coil 120 arranged in the ceramic body, and formed by connecting a plurality of internal coil patterns 121 electrically, and an external electrode 130 formed on the end face of the ceramic body, and connected with the internal coil. The non-magnetic material layer includes a NbO-based dielectric.
申请公布号 JP2015198240(A) 申请公布日期 2015.11.09
申请号 JP20140112225 申请日期 2014.05.30
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 PARK JEONG HYUN
分类号 H01F17/04;H01F17/00;H01F41/04 主分类号 H01F17/04
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