| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer on which many kinds of chips are mounted and by which different kinds of chips having the same chip size can be identified easily.SOLUTION: An exclusion region 7 is formed at an outer periphery of a semiconductor wafer, and the inside of the exclusion region 7 is sectionalized into regions A, B, C, and D of different kinds. The regions A, B, C, and D are sectioned by boundaries 22, 23, and 24. In the vicinity of both ends of the boundaries 21, 22, 23, and 24, mark chips 1, 2, 3, and 4 are arranged. |
