| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for inspecting a tape for wafer processing capable of detecting defects with detecting capability not lower than the existing level even if the tape has an adhesive layer with low light transmission, especially a black adhesive layer.SOLUTION: A device 10 for inspecting a tape for wafer processing includes a light source 13, an irradiation part 15, a detector 19, an encoder 21, and a controller 23. The light source 13 is connected to the irradiation part 15 by an optical fiber 17. Light from the light source 13 is drawn into the irradiation part 15 by the optical fiber 17. The irradiation part 15 desirably has an illuminance of not smaller than 230000 lux at a 15 mm position and more desirably not smaller than 400000 lux (for example, not smaller than 406000 lux). This is because low illuminance cannot bring sufficient light transmission to the black tape wafer processing 1. |
