发明名称 COIL COMPONENT AND HEAT DISSIPATION STRUCTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a coil component which allows for reduction of the product temperature by releasing the heat, generated from the coil, to the outside efficiently, and thereby allows for reduction in the size and weight, and to provide a heat dissipation structure thereof.SOLUTION: In a multilayer inductor 1A having a coil 10A constituted by laminating a metal plate 11 and an insulating plate 12 alternately, and cores 3, 4 forming a closed magnetic path by surrounding the coil, an extension 21 for heat dissipation, extending to the outside of the coil and thermally connected with a housing having a heat dissipation function is formed in a metal plate 11A located at an intermediate part in the lamination direction. Furthermore, an extension 22 for insulation interposed between the extension for heat dissipation and the housing, when thermally connecting the extension for heat dissipation with the housing, and insulating between the extension for heat dissipation and the housing is formed, along the extension for heat dissipation, in an insulating plate 12A adjoining the metal plate in which the extension for heat dissipation is formed.
申请公布号 JP2015198181(A) 申请公布日期 2015.11.09
申请号 JP20140075967 申请日期 2014.04.02
申请人 FDK CORP 发明人 TAKIGUCHI TAKASHI;SANO TETSUYA;SHIMIZU TAKAHIRO
分类号 H01F37/00;H01F17/04;H01F27/08;H01F27/28;H05K7/20 主分类号 H01F37/00
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