| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device which has high heat dissipation, effectively prevents warpage from being generated due to temperature change and has excellent reliability on connection of electronic components, and also to provide a metal base circuit board capable of being suitably applied to the electronic device which has high heat dissipation, effectively prevents warpage from being generated due to temperature change and has excellent reliability on connection of the electric components.SOLUTION: Disclosed is a metal base circuit board 10 which includes: a metal substrate 1; an insulation film 2 provided on the metal substrate 1; and a metal film 3 provided on the insulation film 2. In the metal substrate 1, a groove 11 is provided on a surface side opposite to the insulation film 2. Moreover, it is preferable that both ends of the groove 11 are opened to the side surface of the metal substrate 1. |
