| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing method which enables the occurrence of polishing unevenness to be suppressed.SOLUTION: The polishing method includes a polishing process in which a polishing object surface of a polishing object W held by a polishing head 14 of a retainer is polished by binging the polishing object surface of the polishing object W into such a state that the polishing object surface is in pressurized contact with an abrasive pad and by rotating the retainer and the abrasive pad while a polishing composition is fed. During the polishing process, the polishing object W held by the polishing head 14 of the retainer is rotated in such a way that a state in which the polishing object surface faces the abrasive pad side is maintained, so that an orientation of the polishing object W is changed. |
