| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip thermistor capable of achieving a low profile.SOLUTION: A chip thermistor 1 includes: a thermistor part 3; and a pair of composite parts 5 which are arranged so as to hold the thermistor part 3 and composed of a composite material of metal and a metal oxide. A second main face 3b of the thermistor part 3 and a second main face 5b of the composite part 5 are made to be flush with each other. A plating layer 7 is arranged on a first main face 5a of the composite part 5. A surface 7a of the plating layer 7 is made to be flush with a first main face 3a of the thermistor part 3, or arranged at a position closer to the second main face 3b side than the first main face 3a. |
