THERMOSETTING DIE BOND FILM, DIE BOND FILM WITH DICING SHEET, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a thermosetting die bond film that has a good implantation property of bonding wires and by which a state of wires after implantation can be confirmed, and to provide use applications for the same.SOLUTION: Provided is a thermosetting die bond film whose permeability at a wavelength of 600 nm before thermosetting is 85% or more, and whose melt viscosity at 120°C is 4000 Pa s or less.