| 摘要 |
The present invention relates to a substrate processing apparatus capable of processing a substrate by using plasma. The substrate processing apparatus according to one embodiment of the present invention includes a processing chamber which includes an inner space in which the substrate is processed, a cover member which is combined with the processing chamber by a hinge part and opens or closes the processing chamber by rotating up and down using the hinge part as a shaft, and a closure preventing member which is installed on the sidewall of the cover member and prevents the cover member from being closed in the upward rotation of the cover member. According to the embodiment of the present invention, the safety of a worker is secured by preventing the cover member which opens or closes the processing chamber from being suddenly closed. |
