| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermo-setting die-bonding film which is properly broken by tensile force under low temperature and also to provide an application thereof.SOLUTION: Disclosed is a thermo-setting die-bonding film in which, before thermal setting, a storage elastic modulus A at 0°C is 1 GPa or more, a loss elastic modulus B at 0°C is 500 MPa or less, a loss tangent C at 0°C is 0.1 or less, a glass-transition temperature D exceeds 0°C, and a ratio E of an absolute value of the glass-transition temperature D to the absolute value of the loss tangent C is 600 or more. |
