发明名称 |
APPARATUS AND METHOD FOR SOLDERING |
摘要 |
A soldering apparatus according to an embodiment of the present invention comprises a jig where an object to be soldered is mounted; a hot air gun applying a heat to solder supplied to the object; a driving part where the hot air gun is installed; and a driving controller changing the position of the driving part relative to the jig. |
申请公布号 |
KR20150124797(A) |
申请公布日期 |
2015.11.06 |
申请号 |
KR20140051818 |
申请日期 |
2014.04.29 |
申请人 |
ITM SEMICONDUCTOR CO., LTD. |
发明人 |
PARK, JEONG HO |
分类号 |
B23K3/04;B23K3/08 |
主分类号 |
B23K3/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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