发明名称 |
METHOD FOR BONDING POLYMER FILM AND POLYMER FILM, METHOD FOR BONDING POLYMER FILM AND INORGANIC MATERIAL SUBSTRATE, POLYMER FILM LAMINATE, AND LAMINATE OF POLYMER FILM AND INORGANIC MATERIAL SUBSTRATE |
摘要 |
The present invention provides a method for firmly and inexpensively bonding at low temperature a polymer film to another polymer film or to a glass substrate without the use of an organic adhesive. A method for bonding a polymer film includes a step (S1) for forming a first inorganic material layer on part or all of a first polymer film; a step (S3) for forming a second inorganic material layer on part or all of a second polymer film; a step (S2) for surface-activating the surface of the first inorganic material layer by bombarding with particles having a predetermined kinetic energy; a step (S4) for surface-activating the surface of the second inorganic material layer by bombarding with particles having a predetermined kinetic energy; and a step (S5) for abutting the surface-activated surface of the first inorganic material layer against the surface-activated surface of the second inorganic material layer and bonding the first polymer film and second polymer film together. |
申请公布号 |
HK1203897(A1) |
申请公布日期 |
2015.11.06 |
申请号 |
HK20150104627 |
申请日期 |
2015.05.15 |
申请人 |
SUGA TADATOMO;LAN TECHNICAL SERVICE CO. LTD. |
发明人 |
SUGA TADATOMO;MATSUMOTO YOSHIIE |
分类号 |
B29C;B23K;B29L |
主分类号 |
B29C |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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