| 发明名称 |
Cleaning Device, Peeling System, Cleaning Method and Computer-Readable Storage Medium |
| 摘要 |
A cleaning device peels off an overlapped substrate and cleans a bonding surface of a peeled substrate to be processed, the overlapped substrate including the substrate to be processed and a support substrate bonded together with a protectant, a peeling agent and an adhesive stacked in order therebetween from the substrate to be processed. The cleaning device includes: a support part that supports the substrate to be processed; a solvent supply part that supplies a solvent of the protectant to the bonding surface of the substrate to be processed supported by the support part; and a peeling agent absorption part that absorbs and removes the peeling agent which has been peeled from the bonding surface of the substrate to be processed. |
| 申请公布号 |
US2015314339(A1) |
申请公布日期 |
2015.11.05 |
| 申请号 |
US201514695103 |
申请日期 |
2015.04.24 |
| 申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
HIRAKAWA Osamu;SAKAUE Takashi;KOMEDA Hiroshi;IINO Katsuhiro |
| 分类号 |
B08B3/08 |
主分类号 |
B08B3/08 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A cleaning device that peels off an overlapped substrate and cleans a bonding surface of a peeled substrate to be processed, the overlapped substrate including the substrate to be processed and a support substrate bonded together with a protectant, a peeling agent and an adhesive stacked in order therebetween from the substrate to be processed, the cleaning device comprising:
a support part that supports the substrate to be processed; a solvent supply part that supplies a solvent of the protectant to the bonding surface of the substrate to be processed supported by the support part; and a peeling agent absorption part that absorbs and removes the peeling agent which has been peeled from the bonding surface of the substrate to be processed. |
| 地址 |
Tokyo JP |
