| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which allows at least a side surface of one of a die pad and a lead part to get wet with solder, and to provide a manufacturing method of the semiconductor device.SOLUTION: A semiconductor device 20 includes a lead frame 10 having a die pad 25 and a lead part 26, a semiconductor element 21 placed on the die pad 25 of the lead frame 10, and a bonding wire 22 electrically connecting the lead part 26 of the lead frame 10 with the semiconductor element 21. The lead frame 10, the semiconductor element 21, and the bonding wire 22 are sealed with a sealing resin part 24. The lead part 26 of the lead frame 10 has a bottom surface 28 that is exposed to the exterior and a side surface 29 which continues into the bottom surface 28 and is exposed to the exterior. A number of guide passages 43, which lead solder upwards, are formed on the side surface 29. |
