| 摘要 |
PROBLEM TO BE SOLVED: To provide a die bonder having excellent bonding accuracy; and provide a semiconductor manufacturing method.SOLUTION: In a die bonder and a semiconductor manufacturing method, a die held by a bonding head and a substrate to which the die is to be bonded are recognized by a bonding position recognition camera which recognizes the die and the substrate in the same field of view and bonding position correction is performed thereby to achieve bonding with higher accuracy. |
