发明名称 PHOTOCURABLE CONDUCTIVE MATERIAL, CONNECTION STRUCTURE AND METHOD OF PRODUCING CONNECTION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a photocurable conductive material that is used for connection of a connection object member having an electrode on its surface, suppresses warpage of the connection object member to be able to improve reliability of electric conductivity between electrodes, and prevents occurrence of voids at joint interfaces to be able to improve reliability of connection between the connection object member and a cured product of the conductive material.SOLUTION: A photocurable conductive material according to the present invention is used for connection of a connection object member having an electrode on its surface, and has photocurability. The conductive material comprises conductive particles, photocurable compounds, light cationic polymerization initiators, and photocuring retarders, the photocuring retarders being tertiary amine compounds.
申请公布号 JP2015195199(A) 申请公布日期 2015.11.05
申请号 JP20150060697 申请日期 2015.03.24
申请人 SEKISUI CHEM CO LTD 发明人 MAHARA SHIGEO
分类号 H01B1/22;C08G59/68;C08K5/17;C08K5/3492;C08L63/00;C08L101/12;H01R4/04;H01R11/01;H01R43/00 主分类号 H01B1/22
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