| 发明名称 |
METHOD OF MAKING WAFER ASSEMBLY |
| 摘要 |
A method including bonding a process wafer having integrated circuits and a carrier wafer having at least one alignment mark to form a wafer assembly. The method further includes aligning the wafer assembly using the at least one alignment mark of the carrier wafer. |
| 申请公布号 |
US2015318165(A1) |
申请公布日期 |
2015.11.05 |
| 申请号 |
US201514798799 |
申请日期 |
2015.07.14 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
HUANG I-Hsiung;LIU Heng-Hsin;LEE Heng-Jen;LIN Chin-Hsiang |
| 分类号 |
H01L21/02 |
主分类号 |
H01L21/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method, comprising:
bonding a process wafer having integrated circuits and a carrier wafer having at least one alignment mark to form a wafer assembly; and aligning the wafer assembly using the at least one alignment mark of the carrier wafer. |
| 地址 |
Hsinchu TW |
