TEMPERATURE CONTROL IN PLASMA PROCESSING APPARATUS USING PULSED HEAT TRANSFER FLUID FLOW

摘要

Methods and systems for controlling temperatures in plasma processing chamber via pulsed application of heating power and pulsed application of cooling power. In an embodiment, temperature control is based at least in part on a feedforward control signal derived from a plasma power input into the processing chamber. In further embodiments, fluid levels in each of a hot and cold reservoir coupled to the temperature controlled component are maintained in part by a passive leveling pipe coupling the two reservoirs. In another embodiment, digital heat transfer fluid flow control valves are opened with pulse widths dependent on a heating/cooling duty cycle value and a proportioning cycle having a duration that has been found to provide good temperature control performance.

主权项

1. A method of controlling a temperature of a chuck in a plasma processing apparatus, the method comprising:
providing a first heat transfer fluid at a first temperature to the chuck via a first supply line and a first return line coupling the chuck to a first heat transfer fluid reservoir; providing a second heat transfer fluid at a second temperature to the chuck via a second supply line and a second return line coupling the chuck to a second heat transfer fluid reservoir; controlling a first valve coupling the first heat transfer fluid reservoir with the first supply line and controlling a second valve coupling the second heat transfer fluid reservoir with the second supply line; and equalizing a level of the first heat transfer fluid reservoir with a level of the second heat transfer fluid reservoir by flowing either the first or second heat transfer fluid through a passive leveling pipe coupling the first heat transfer fluid reservoir to the second heat transfer fluid reservoir.