| 摘要 |
The present invention allows a load port which processes wafers of different sizes to use a wafer mapping apparatus. A left-right span between a light transmission unit (5a) and a light receiving unit (5b) of a mapping sensor (5) having an optical axis (L1) towards a left-right horizontal direction is arranged to be narrower than a span of a front opening of a open cassette (12) which is a smaller one among differently-sized containers conveyed to the load port to install the mapping sensor (5) on a mapping device (4). A first protrusion sensor (6) having an optical axis (L2) towards the left-right horizontal direction is installed on the mapping device (4) to be separated from the mapping sensor (5) in front of a moving direction of the mapping sensor (5). A second protrusion sensor (7) having an optical axis towards a vertical moving direction of the mapping sensor (5) is installed to allow the load port which processes wafers (W1, W2) of different sizes to use the wafer mapping apparatus (1). |
