METAL-CLAD LAMINATE AND CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a metal-clad laminate including an insulation resin layer with dielectric characteristics in which dependence on water content is suppressed while allowing an electronic apparatus to cope with high frequency by lowering a dielectric constant, in particular an insulation resin layer in which dependence on water content of dielectric tangent is reduced; and to provide a circuit board.SOLUTION: There is provided a metal-clad laminate including the following constitutions a), b) and c): a) a value E, which is an index value indicating dielectric characteristics at 15 GHz after one hour drying at 100°C, is 0.007 or less; b) a ratio E/Eis in a range of 1.0 to 4.0 at the value Ewhich is an index value indicating dielectric characteristics at 15 GHz after twenty-four hour immersion in pure water under the constant temperature and the constant humidity of 23°C and 50% RH; and c) a thermal expansion coefficient is in a range of 10 ppm/K to 30 ppm/K.