WIRING BOARD AND METHOD FOR MANUFACTURING SAME

摘要

A wiring board includes a core structure having a first surface and a second surface on the opposite side of the first surface, a first buildup structure formed on the first surface of the core structure and including insulation layers, and a second buildup structure formed on the second surface of the core structure and including insulation layers and an inductor device. The insulation layers in the second buildup structure have the thicknesses which are thinner than the thicknesses of the insulation layers in the first buildup structure, and the inductor device in the second buildup structure is position on the second surface of the core structure and includes at least a portion of a conductive pattern formed in the core structure.

主权项

1. A method for manufacturing a wiring board, comprising:
preparing a core structure; forming on a first surface of the core structure a first buildup structure comprising a plurality of insulation layers; and forming on a second surface of the core structure on an opposite side of the first surface of the core structure a second buildup structure comprising a plurality of insulation layers and a inductor device, wherein the insulation layers in the second buildup structure have thicknesses which are thinner than thicknesses of the insulation layers in the first buildup structure, and the forming of the second buildup structure comprises forming the inductor device in the second buildup structure on the second surface of the core structure such that at least a portion of a conductive pattern formed in the core structure is included as a portion of the inductor device.