| 发明名称 |
LIGHT EMITTING DIODE PACKAGE |
| 摘要 |
A light emitting diode (LED) package includes an LED chip, a first lead frame and a second lead frame electrically connected to the LED chip and separated by a space, and a housing disposed on the first lead frame and the second lead frame. The housing includes an external housing surrounding a cavity, the cavity exposing a first portion of the first lead frame and a first portion of the second lead frame, and an internal housing disposed in the space, the internal housing covering a top portion of the first lead frame and a top portion of the second lead frame. |
| 申请公布号 |
US2015318457(A1) |
申请公布日期 |
2015.11.05 |
| 申请号 |
US201514739733 |
申请日期 |
2015.06.15 |
| 申请人 |
Seoul Semiconductor Co., Ltd. |
发明人 |
KIM Bang Hyun |
| 分类号 |
H01L33/62;H01L27/15;H01L25/075;H01L33/48 |
主分类号 |
H01L33/62 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light emitting diode (LED) package, comprising:
at least one LED chip; a first lead frame and a second lead frame electrically connected to the at least one LED chip and separated by a space; and a housing disposed on the first lead frame and the second lead frame, the housing comprising: an external housing surrounding a cavity, the cavity exposing a first portion of the first lead frame and a first portion of the second lead frame; and an internal housing disposed within the cavity, the internal housing comprising a first bridge extending from inner side surfaces of the external housing to intersect the space. |
| 地址 |
Ansan-si KR |
