| 发明名称 |
PACKAGE METHOD AND PACKAGE |
| 摘要 |
A package method includes steps of providing a light emitting module, a mold and a molding compound, wherein the light emitting module includes a substrate and at least one light emitting unit disposed on the substrate, the mold has at least one recess, and a side wall of the recess is parallel to a side surface of the light emitting unit; filling the recess with the molding compound; placing the substrate on the mold reversely, so that the light emitting unit is immersed into the recess and the molding compound directly encapsulates the light emitting unit; and heating and pressing the substrate and the mold, so as to solidify the molding compound. |
| 申请公布号 |
US2015318453(A1) |
申请公布日期 |
2015.11.05 |
| 申请号 |
US201514690480 |
申请日期 |
2015.04.20 |
| 申请人 |
Genesis Photonics Inc. |
发明人 |
Hung Chin-Hua;Lee Hao-Chung;Lin Yu-Feng |
| 分类号 |
H01L33/50;H01L33/52 |
主分类号 |
H01L33/50 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package method comprising:
providing a light emitting module, a mold and a molding compound, wherein the light emitting module comprises a substrate and at least one light emitting unit disposed on the substrate, the mold has at least one recess, and a side wall of the recess is parallel to a side surface of the light emitting unit; filling the recess with the molding compound; placing the substrate on the mold reversely, so that the light emitting unit is immersed into the recess and the molding compound directly encapsulates the light emitting unit; and heating and pressing the substrate and the mold, so as to solidify the molding compound. |
| 地址 |
Tainan City TW |
