| 摘要 |
The invention relates to a circuit arrangement (SA) comprising: a carrier part (GD); a power component (LB1, LB2, LB3); a cooling channel (KK) for conveying a cooling agent; and a bus bar (SS1, SS2) for conducting a current to the power component (LB1, LB2, LB3), said bus bar being arranged on the carrier part (GD) and having a region (B12, B22) that projects away from the carrier part (GD) into the cooling channel (KK) by a first surface (OF11, OF21) and by a second surface (OF12, OF22) opposite the first surface (OF11, OF21), wherein the power component (LB1, LB2, LB3) is arranged on the first surface (OF11, OF21) of the region (B12, B22), and is connected to the region (B12, B22) in an electrically conductive and mechanical manner. With a circuit arrangement (SA) of this type, the waste heat from the power component can be more efficiently discharged. |
