| 发明名称 |
EPOXY RESIN COMPOSITION, AND PRINTED CIRCUIT BOARD USING SAME |
| 摘要 |
According to one embodiment of the present invention, an epoxy resin composition comprises an epoxy compound, a curing agent, and an inorganic filler, wherein the inorganic filler includes boron nitride (BN). |
| 申请公布号 |
US2015319856(A1) |
申请公布日期 |
2015.11.05 |
| 申请号 |
US201314651783 |
申请日期 |
2013.12.06 |
| 申请人 |
LG INNOTEK CO., LTD. |
发明人 |
YUN Sungjin;PARK Jea Man;YOON Jong Heum;HAN Young Ju |
| 分类号 |
H05K1/03;C08K3/22;C08K3/38 |
主分类号 |
H05K1/03 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An epoxy resin composition comprising:
an epoxy compound represented by the following Formula 1; a curing agent comprising diaminodiphenyl sulfone; and an inorganic filler, wherein the inorganic filler comprises boron nitride (BN): wherein R1 to R14 may each independently be selected from the group consisting of H, Cl, Br, F, a C1-C3 alkyl, a C2-C3 alkene, and a C2-C3 alkyne, and m and n may each be 1, 2 or 3. |
| 地址 |
Jung-gu Seoul KR |
