发明名称 |
ELECTRONIC ELEMENT MOUNTING BOARD AND ELECTRONIC DEVICE |
摘要 |
There are provided an electronic element mounting board and an electronic device capable of suppressing transmission of incident light to an electronic device through a circumferential edge part of an opening of a board and thus of reducing a noise level in receiving an image. An electronic element mounting board includes an insulating substrate. The insulating substrate has an opening and a lower surface, and an electronic element is disposed on the lower surface so as to overlap the opening in a plan view. A circumferential edge part of the opening of the insulating substrate has a porosity lower than a porosity of a portion outside the circumferential edge part. Since it is possible to suppress transmission of incident light to the electronic element through the circumferential edge part, it is possible to reduce a noise level in receiving an image in the electronic element. |
申请公布号 |
US2015319846(A1) |
申请公布日期 |
2015.11.05 |
申请号 |
US201414650353 |
申请日期 |
2014.04.28 |
申请人 |
KYOCERA CORPORATION |
发明人 |
KUBO Shuya;SUDA Kouki;ISHIMABUSHI Tsuyoshi;ICHIKI Shinji;MORIYAMA Yousuke |
分类号 |
H05K1/02;H05K1/11;H05K1/18 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
1. An electronic element mounting board, comprising:
an insulating substrate having a lower surface and an opening which opens on the lower surface; and an electrode pad disposed on the lower surface around the opening, at least a part of a circumferential edge part of the opening having a porosity lower than a porosity of a portion outside the circumferential edge part in the insulating substrate. |
地址 |
Kyoto-shi, Kyoto JP |