发明名称 ELECTRONIC ELEMENT MOUNTING BOARD AND ELECTRONIC DEVICE
摘要 There are provided an electronic element mounting board and an electronic device capable of suppressing transmission of incident light to an electronic device through a circumferential edge part of an opening of a board and thus of reducing a noise level in receiving an image. An electronic element mounting board includes an insulating substrate. The insulating substrate has an opening and a lower surface, and an electronic element is disposed on the lower surface so as to overlap the opening in a plan view. A circumferential edge part of the opening of the insulating substrate has a porosity lower than a porosity of a portion outside the circumferential edge part. Since it is possible to suppress transmission of incident light to the electronic element through the circumferential edge part, it is possible to reduce a noise level in receiving an image in the electronic element.
申请公布号 US2015319846(A1) 申请公布日期 2015.11.05
申请号 US201414650353 申请日期 2014.04.28
申请人 KYOCERA CORPORATION 发明人 KUBO Shuya;SUDA Kouki;ISHIMABUSHI Tsuyoshi;ICHIKI Shinji;MORIYAMA Yousuke
分类号 H05K1/02;H05K1/11;H05K1/18 主分类号 H05K1/02
代理机构 代理人
主权项 1. An electronic element mounting board, comprising: an insulating substrate having a lower surface and an opening which opens on the lower surface; and an electrode pad disposed on the lower surface around the opening, at least a part of a circumferential edge part of the opening having a porosity lower than a porosity of a portion outside the circumferential edge part in the insulating substrate.
地址 Kyoto-shi, Kyoto JP