| 摘要 |
PROBLEM TO BE SOLVED: To provide a positive type photosensitive resin from which a resist pattern having a desired cross-sectional shape can be formed with a low dose of exposure light and, even when a coating film of the photosensitive resin composition is left for a while and then exposed and developed, a pattern with a desired dimension can be formed.SOLUTION: The photosensitive resin composition comprises: (A) an alkali-soluble resin; and (B) a non alkali-soluble resin, which contains an OH group protected by a protective group having a specific structure and has a hydrophilic group having a predetermined structure in an exposed state. |
