发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE FILM USING SAME
摘要 The present invention relates to a positive-type photosensitive resin composition comprising (A) a modified novolac-type phenol resin having an unsaturated hydrocarbon group, (B) a novolac-type phenol resin obtained from metacresol and paracresol, (C) a novolac-type phenol resin obtained from orthocresol, (D) a compound generating an acid by light, and (E) a polybasic acid or a polybasic acid anhydride, wherein the content of the (E) component is lower than 40 parts by mass per 100 parts by mass of the total amount of the (A) component, the (B) component, the (C) component and the (D) component.
申请公布号 US2015315379(A1) 申请公布日期 2015.11.05
申请号 US201314651081 申请日期 2013.12.05
申请人 HITACHI CHEMICAL COMPANY, LTD. 发明人 UEDA Satoko;SAWABE Ken
分类号 C08L63/04;C08J5/18 主分类号 C08L63/04
代理机构 代理人
主权项 1. A positive-type photosensitive resin composition, comprising: (A) a modified novolac-type phenol resin having an unsaturated hydrocarbon group; (B) a novolac-type phenol resin obtained from metacresol and paracresol; (C) a novolac-type phenol resin obtained from orthocresol; (D) a compound generating an acid by light; and (E) a polybasic acid or a polybasic acid anhydride, wherein a content of the polybasic acid or the polybasic acid anhydride is lower than 40 parts by mass per 100 parts by mass of a total amount of the modified novolac-type phenol resin having an unsaturated hydrocarbon group, the novolac-type phenol resin obtained from metacresol and paracresol, the novolac-type phenol resin obtained from orthocresol and the compound generating an acid by light.
地址 Tokyo JP