| 摘要 |
Provided are a method for forming a photoresist pattern obtained by decompressing a photoresist film, and a method for manufacturing an integrated circuit device. The method for forming a photoresist pattern discharges bubbles from a photoresist film by decompressing the photoresist film. The method for manufacturing an integrated circuit device forms a photoresist film on a substrate including at least one electronic component; and discharges bubbles from the photoresist film by decompressing the photoresist film. A photoresist pattern for covering the electronic component is formed by exposing and developing the photoresist film. |
