METHOD OF MANUFAUCTURING SEMICONDUCTOR DEVICE AND METHOD OF MAINTAINING DEPOSITION APPARATUS

摘要

According to an aspect of the present invention, provided is a method for manufacturing a semiconductor device which comprises the following steps of: forming an aluminum compound film on a surface contacting flow of an aluminum source by supplying the aluminum (Al) source to a process chamber; arranging a wafer in a susceptor installed in the process chamber; and forming a thin film for a semiconductor device on the wafer.