| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a substrate processing method, capable of processing a substrate without using a top mounting roller and such in substrate processing by spraying a fluid to the substrate.SOLUTION: A substrate processing apparatus 31 includes: a high-pressure tool 22, placed on an upper surface of a substrate 11 that is transferred while a lower surface thereof is held by a transport device 33, for injecting high-pressure cleaning water; and a high-pressure tool 23 for injecting high-pressure cleaning water to a lower surface of the substrate 11. The substrate processing apparatus 31 processes the substrate 11 while injecting the high-pressure cleaning water from each of the high-pressure tool 22 and the high-pressure tool 23. The substrate processing apparatus 31 is so configured that the high-pressure cleaning water is injected so that a downward force acting on the substrate 11 is larger than an upward acting force. |
