WAFER LEVEL PACKAGE AND FAN OUT RECONSTITUTION PROCESS FOR MAKING THE SAME

摘要

A wafer level package device may include a molding compound that encapsulates a substrate, a back end of line and front end of line layer on the substrate and a passivation layer of a redistribution layer without encapsulating a metal layer on the passivation layer.

主权项

1. A wafer level package device comprising:
a substrate having a non-active substrate side extending between a first substrate sidewall and a second substrate sidewall and an active substrate side extending between a third substrate sidewall and a fourth substrate sidewall; a redistribution layer coupled to the active substrate side, the redistribution layer having a metal layer and a dielectric layer; and a molding compound encapsulating the substrate and the metal layer being free of the molding compound.