SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

摘要

A rotation holding device is rotated about a rotation axis, and a controller calculates a rotation direction offset amount, an X offset amount and a Y offset amount based on position data that is acquired from a line sensor. An X direction movable portion and a Y direction movable portion are moved such that the X offset amount and the Y offset amount become 0, and the rotation holding device is rotated such that the rotation direction offset amount becomes 0. A film thickness measurement device sequentially measures the thickness of a film on a substrate while the X direction movable portion is moved in an X direction.

主权项

1. A substrate processing apparatus that performs processing on a substrate, comprising:
a rotation holding device that holds the substrate and rotates the substrate about a rotation axis; a moving device that moves the rotation holding device in a two-dimensional direction that is orthogonal to the rotation axis; a position detector that detects a position of an outer periphery of the substrate rotated by the rotation holding device; and a controller that controls the moving device based on the position detected by the position detector such that a center of the substrate held by the rotation holding device coincides with a predetermined reference axis.