| 摘要 |
PROBLEM TO BE SOLVED: To facilitate any waveform measuring of electronic components such as BGA (ball grid array)-shaped components.SOLUTION: A jig substrate 11 of a substrate inspection jig 10 is arranged, using a fixing member 14, above the rear surface of an inspection target substrate 20 on which an electronic component 30 is mounted, and has a plurality of through holes. Measurement pins 12 can move vertically through the respective through holes of the jig substrate 11 and perform waveform measuring by contacting corresponding through hole vias 21 of the inspection target substrate 20. A lock member 13 locks the movement of each measurement pin. The lock member 13 is capable of unlocking, and unlocks any lock member 13 to bring the unlocked measurement pin 12 into contact with the through hole via 21 of the inspection target substrate 20. |
